Vision Solution for Glass Substrate TGV Inspection
High-density vias. Micron-scale defects. One-pass full scan.
As the semiconductor industry accelerates toward Panel-Level Packaging (PLP) and glass-core substrates to meet the demands of AI, HPC, and advanced chiplet architectures, traditional inspection methods are falling short. The shift to large-format glass panels introduces new challenges—and new opportunities. At Basler, we've developed a patented inspection solution tailored for high-density TGV inspection on glass substrates. Our vision solution delivers one-pass, full inspection with industry-leading clarity and speed.
Critical inspection points in the TGV manufacturing process
Glass substrate manufacturing involves multiple precision processes—from via laser drilling and wet etching to metallization and copper filling—each requiring rigorous quality control. As high-density interconnects become standard in advanced packaging, it is critical to ensure that all vias are present and free from defects. Missing or malformed vias can lead to serious downstream failures and costly yield losses. Inspection must verify proper via formation, metallization, and structural integrity across the entire panel. Thorough glass substrate inspection is the essential first step toward reliable, high-performance packaging.
The challenge with glass substrates isn’t just their transparency and high reflectivity—it’s the need to inspect thousands of micron-scale vias at speed. That’s exactly what we’ve solved.
One-scan TGV inspection: maximize throughput with no blind spots
Is your AOI system holding you back?
Current AOI systems struggle with full-area inspection of large glass substrates (e.g., 510 mm x 500 mm) used in Through Glass Via (TGV) manufacturing, often compromising between inspection area, resolution, and throughput. Critical micro-defects—such as cracks, bubbles, sidewall roughness, and misaligned double-conical vias—frequently go undetected, particularly due to the transparent nature of the material and the complexity of 3D via structure.
One-scan precision. Zero blind spots.
Our patented one-scan TGV inspection solution overcomes these challenges by combining vision system optical design, high resolution imaging and advanced image processing algorithms, delivering:
Full-panel inspection in a single scan with no blind spots
Robust detection of complex defects including conicity misalignment, edge chipping, and depth inconsistencies
Micron-level analysis of taper angle, sidewall integrity, via depth, pitch, and diameter
This integrated vision solution provides images with excellent contrast for accurate, high-throughput TGV inspections, significantly improving process control and yield in advanced substrate manufacturing.
Want to see what our system really delivers?
Contact us for a demo or real use case image preview—see for yourself how clearly we visualize your toughest defects.
Inspect glass substrate with confidence
Inspecting glass isn’t new—but inspecting it with this level of clarity, speed, and scalability is.
If you’re facing technical bottlenecks in glass substrate TGV inspection, we’re ready to help. Our advanced vision solution has already proven effective in overcoming key inspection hurdles. More importantly, our team is ready to analyze your unique requirements and deliver tailored technical consultation. Let’s redefine what’s possible in glass TGV inspection—together.