Basler to Showcase Innovative Vision Solution at Semicon SEA 2026

From 5-7 May, Basler will present our latest machine vision solutions at Semicon Southeast Asia 2026, featuring a demonstration of our latest high-performance TDI system. Join us to explore how our latest innovations in imaging will benefit the semiconductor industry.

Date: 5-7 May 2026

Location: MITEC (Kuala Lumpur, Malaysia)

Booth Number: Level 2, Booth #A2737 (Soda Vision Pte. Ltd.)

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Show Highlights

High-Performance 16K TDI System

Our high-performance TDI System delivers a complete, ready-to-deploy TDI line-scan solution, integrating camera, frame grabber, software, and peripherals into a single high-performance platform. Designed for CoF applications, it combines next-generation TDI sensors with up to 100 Gbps bandwidth to support ultra-fast, high-precision inspection. VisualApplets-based pre-processing shifts computation closer to the data source, reducing CPU/GPU load, simplifying system architecture, and lowering total cost of ownership—enabling customers to scale CoF inspection performance with confidence. See our new TDI system in action for high-speed, high-precision wafer inspection.

Our team of experts will be available on-site to provide you with the best solutions for your application. This includes detailed technical consultation along with on-site demonstrations.

For more information or to schedule a consultation, please contact us below