3 Vision Trends Shaping High-Resolution Wafer Inspection

Higher Resolution, New Demands on Wafer AOI 

As HBM, chiplets and advanced packaging drive finer structures, wafer AOI developers must consider how imaging choices affect the entire inspection system. 

Finer pixel sampling reduces field of view and increases scan coverage requirements. Higher optical resolution tightens focus tolerances, no single lighting condition reveals every defect, and high-speed acquisition generates more image data than a host PC can easily handle. 

In this 30-minute VisionCast, explore 3 connected vision trends in high-resolution wafer inspection: from optical resolution, TDI and autofocus to bright-field and dark-field imaging, to handling gigabytes of image data per second. Understand the trade-offs that shape imaging performance and inspection throughput. 

Date and time: 

Date: 19th November 2026 

Time: 3pm (SGT) 

Duration: 30 minutes 

Language: English 

What you will learn 

1. See finer: Balancing resolution and throughput 
   How to balance optical resolution, pixel sampling, depth of focus and scan time, and what keeps image quality stable at high scan speed. 

2. See more: Choosing lighting and height approaches 
   How to combine lighting conditions without multiplying scan time, and how to match 3D methods to the height information a task actually needs. 

3. See faster: Designing the data path 
   Where to reduce image data along the chain, from camera to frame grabber to host, so processing keeps up with acquisition. 

Who should attend? 

This webinar is designed for: 

• Vision, optical, software and system R&D engineers at OEMs and system integrators developing high-resolution wafer inspection equipment. 

• Technical leads responsible for optical and imaging architecture decisions in wafer AOI systems, from optics and lighting to focus control and data path . 

• Inspection, equipment and process engineers at semiconductor fabs and OSATs evaluating imaging approaches for fine-feature wafer inspection.