Tackling Advanced Packaging Challenges Through Vision
Basler Semicon VisionCast – Webinar Series on Vision Solutions for Semiconductor
As semiconductor advanced packaging continues to evolve with finer structures and higher integration, inspection processes require higher precision, speed, and stability than ever before. In this webinar, Basler will outline the key challenges in equipment development and present the latest vision approaches that support high-precision inspection, illustrated with real-world examples.
This webinar is brought to you by Soda Vision and Basler.
Evolving Packaging Technologies Redefining Inspection Standards
Advanced packaging technologies such as 2.5D/3D integration and CPO are rapidly diversifying. As miniaturization and higher density progress, inspection requirements for precision, speed, and stability are becoming increasingly demanding. The transition to glass core substrates, defect detection below 2 µm, and heterogeneous material stacking have introduced challenges that conventional AOI systems can no longer easily address.
This webinar examines these inspection challenges and introduces the latest vision approaches – from imaging techniques and optical design to image processing – that support the development of advanced inspection equipment.
Key take-aways include:
Evolution of advanced packaging technologies and changing inspection requirements
Five representative inspection challenges, including depth of field and fine structure detection
Implementation examples using SWIR, HDR, and FPGA processing
Vision approaches to achieve precision, speed, and stability in inspection equipment
Who will benefit:
Engineers involved in the development and design of semiconductor packaging inspection systems
AOI system integrators and OEM equipment manufacturers
Engineers seeking to enhance inspection accuracy and optimize system performance
Professionals exploring new vision approaches for semiconductor inspection
Date and time:
04 December 2025 (Thursday), 2:00-2:30PM (SGT)