White Paper

Tackling the Top 5 Critical Vision Challenges in Advanced Semiconductor Packaging Inspection

Bridging precision and yield in high-performance inspection

Advanced packaging is moving beyond 2.5D/3D integration (CoWoS, X‑Cube, Foveros) to next‑generation technologies such as TGV substrates, FOPLP, and CPO. This shift increases geometric complexity, feature sizes below 2 µm, and the use of glass cores, driving stricter precision requirements. Vision inspection has evolved from simple quality control to critical inline inspection, ensuring each process step succeeds. However, conventional AOI systems struggle to deliver submicron inspection at production speed.

This white paper highlights five key vision inspection challenges and strategic directions to meet the needs of advanced semiconductor packaging.

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What’s inside:

  • Semiconductor Advanced Packaging Evolution  

  • The Evolving Role of Vision in Advanced Packaging 

  • 5 Critical Inspection Challenges & Vision Solutions 

  • Conclusion


Who should read this?

  • OEMs, AOI system integrators, and machine makers developing advanced inspection systems

  • Vision engineers, system engineers, and R&D leaders driving technology adoption

  • Purchasing managers and executives evaluating high-precision inspection strategies



Tackling the Top 5 Critical Vision Challenges in Advanced Semiconductor Packaging Inspection
Preview of our white paper on 5 critical vision inspection challenges in 2.5D/3D advanced packaging