Your browser is out of date. It may not display all features of this websites. Learn how to update your browser.

Start configuring your vision system now Webshop

Flexible 3D AOI System with CoaXPress 2.0 Components

Flexible 3D AOI System with CoaXPress 2.0 Components

During the production of electronic printed circuit boards, optical inspections for quality assurance purposes take place at numerous workstations. The 3D AOI system with CXP-12 interface offers flexibility and can be used for the individual production steps for the respective inspection task. The AOI system meets the different requirements at the workstations by having a movable camera head and interchangeable components such as camera, lighting and frame grabber. A possible configuration of the image processing system consists of a CXP-12 head camera (monochrome or color), supplemented by strip light projectors and a frame grabber or interface card, as well as four side cameras.

To process image data from the head camera, the FPGA-based CXP-12 interface cards and programmable frame grabbers with 1 to 4 channels are available. These are also offered as a product bundle with the boost camera.

The 3D AOI inspection system for component and solder joint inspection of printed circuit boards generates highly precise and detailed 3D images (color or monochrome) at higher speed thanks to the CXP-12 technology used. Previously-used camera interfaces such as Camera Link and CoaXPress 1.1.1 can be replaced by the new standard with little integration effort and no further cost increases.

More in the Use Case

You have questions?
We have the answers!

Our Sales and Technical Support experts are avaiable to advise you on all aspects of Basler computer vision components and solutions.

Contact us

Back to Webshop