Devices such as computers, cell phones, and TVs all use circuits that contain many electronic components. The active electronic components used in these devices are produced on semiconductor wafers. The density and complexity of today’s wafers is growing from year to year. This increases the requirements for quality control and for the camera systems used to inspect the materials. Optical inspection systems are required at different steps in the semiconductor production process, from inspection of the unstructured wafer material to inspection of the final circuits.
Basler cameras are designed to meet the needs of all mainstream semiconductor applications. Among their many other features, they offer:
- High speed
- High resolution
- An outstanding price/performance ratio
- Cable lengths up to 100 meters
Typical applications include:
- Automated Optical Inspection (AOI)
- Quality control of semiconductor wafers
- Inspection in dicing and bonding systems
- Process control
Please contact us if you would like to discuss how our camera capabilities can benefit your application.